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VIA IN/ON PAD

VIA IN/ON PAD

Via-In-Pad (VIP) or Via-On-Pad (VOP) ​

Vias filled with epoxy and plated with copper on surface.

Description:

Plated through holes filled with conductive (or non-conductive) epoxy plugging ink, subsequently planarized and plated over. The via in pad approach places a via directly under the device’s contact pads. This allows higher component density and improved routing. Consequently, via in pad provides the designer significant PCB space savings.