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HDI PCB (High Density Interconnect) 2 + N + 2

Material:FR-4 High Tg

Board Thickness:1.2mm 

Layer:10 Layers

Surface Finished:ENIG:2μ" / 150μ" (Electroless Nickel Immersion Gold)

Copper Weight:1.0 oz

HDI (High Density Interconnect) 1 + N + 1

Mechanical Drill / Vias are filled with epoxy:L3-L8

Laser Drill / Vias are plated and filled with copper:L1-L2 / L9-L10 / L2-L3 / L8-L9