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HDI PCB (High Density Interconnect ) 1 + N + 1

Material:FR-4 High Tg

Board Thickness:1.6mm 

Layers:6 Layers

Surface Finished:ENIG (Electroless Nickel Immersion Gold)

Copper Weight:1.0 oz.

HDI (High Density Interconnect) 1 + N + 1

Laser Drill / Vias are plating and filled with copper:L1 - L2